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New Image Sensor
Sony Develops World's First Stacked CMOS Image Sensor Technology with 2-Layer Transistor Pixel
16 Dec, 2021
Sony Semiconductor Solutions Corporation (“Sony”) has succeeded in developing the world’s first stacked CMOS image sensor technology with 2-Layer Transistor Pixel.
Maker Faire x Sony
Maker Faire Rome
Sony to showcase innovations at Maker Faire Rome 2021 as official Gold Partner
08 Oct, 2021
Hiroaki Kitano, President and CEO of Sony Computer Science Laboratories, delivers speech at the Opening Conference.
AITRIOS™ logo
AITRIOS™
Sony to Launch Edge AI Platform Service AITRIOS™ To Streamline the Development and Implementation of AI Camera-Driven Sensing Solutions
06 Oct, 2021
Atsugi, Japan — Sony Semiconductor Solutions Corporation (“Sony”) announced today that its AITRIOS™ edge AI sensing platform will launch in Japan, the U.S. and Europe starting from late 2021. Sony is now widely recruiting corporate partners, inviting their involvement in the development and implementation of AI camera-driven and other sensing solutions that will make the most of this platform.
IMX487 UV image sensor
New Image Sensor
Sony to Release UV Wavelength-Compatible CMOS Image Sensor Equipped with Global Shutter Function and Industry's Highest Effective Pixel Count of Approx. 8.13 Megapixels
29 Sep, 2021
Atsugi, Japan — Sony Semiconductor Solutions Corporation (Sony) today announced the commercialization of the IMX487, a 2/3-type CMOS image sensor for industrial equipment, which is compatible with the UV (ultraviolet light) wavelength and comes with global shutter functionality and the industry’s highest effective pixel count of approximately 8.13 megapixels.
comparison of two sensors
New event-based vision sensors
Sony to release two types of stacked event-based vision sensors with the industry’s smallest*1 4.86 micrometre pixel size for detecting subject changes only
09 Sep, 2021
Atsugi, Japan — Sony Semiconductor Solutions Corporation (“Sony”) today announced the upcoming release of two types of stacked event-based vision sensors. These sensors designed for industrial equipment are capable of detecting only subject changes, and achieve the industry’s smallest*1 pixel size of 4.86μm.
ToF depth sensor stacked configuration
New industry first sensor
Sony to release a stacked SPAD depth sensor for automotive LiDAR applications, an industry first
06 Sep, 2021
Atsugi, Japan — Sony Semiconductor Solutions Corporation today announced the upcoming release of the IMX459 stacked SPAD depth sensor for automotive LiDAR applications using direct Time-of-Flight (dToF) method, an industry first.
Genius tip with IMX500 in a smart city trial in Rome
Smart city trial in Rome
Sony cooperates in smart city trial project in Rome using intelligent vision sensors to reduce traffic, optimise public transportation and support pedestrian safety
27 May, 2021
Sony Europe has announced its IMX500 image sensors with AI processing functionality are at the core of three smart city trials being run by Envision in the municipality of Rome. These are intended to cut the city’s transport-related pollution and accidents at pedestrian crossings.
CMOS
Press Release
Sony to release large format CMOS image sensor with global shutter function and industry’s highest effective pixel count of 127.68 megapixels
09 Mar, 2021
Sony Corporation announced today the upcoming release of a large format 56.73mm diagonal CMOS image sensor “IMX661” for industrial equipment with a global shutter function and the industry’s highest effective pixel count of 127.68 megapixels
Sony's Intelligent Vision Sensors IMX500 (left) and IMX501 (right)
Press Release
Sony to release world’s first Intelligent Vision Sensors with AI processing functionality
14 May, 2020
Sony Corporation today announced the upcoming release of two models of intelligent vision sensors, the first image sensors in the world to be equipped with AI processing functionality. Including AI processing functionality on the image sensor itself enables high-speed edge AI processing and extraction of only the necessary data, which, when using cloud services, reduces data transmission latency, addresses privacy concerns, and reduces power consumption and communication costs.

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