Atsugi, Japan — Sony Semiconductor Solutions Corporation (“Sony”) today announced the upcoming release of two types of stacked event-based vision sensors. These sensors designed for industrial equipment are capable of detecting only subject changes, and achieve the industry’s smallest*1 pixel size of 4.86μm.

Atsugi, Japan — Sony Semiconductor Solutions Corporation today announced the upcoming release of the IMX459 stacked SPAD depth sensor for automotive LiDAR applications using direct Time-of-Flight (dToF) method, an industry first.

Sony Europe has announced its IMX500 image sensors with AI processing functionality are at the core of three smart city trials being run by Envision in the municipality of Rome. These are intended to cut the city’s transport-related pollution and accidents at pedestrian crossings.

Sony Corporation announced today the upcoming release of a large format 56.73mm diagonal CMOS image sensor “IMX661” for industrial equipment with a global shutter function and the industry’s highest effective pixel count of 127.68 megapixels

Sony Corporation today announced the upcoming release of two models of intelligent vision sensors, the first image sensors in the world to be equipped with AI processing functionality. Including AI processing functionality on the image sensor itself enables high-speed edge AI processing and extraction of only the necessary data, which, when using cloud services, reduces data transmission latency, addresses privacy concerns, and reduces power consumption and communication costs.